80v logic n-channel mosfet general description these n-channel enhancement mode power field effect transistors are produced using kersemi proprietary, planar stripe, dmos technology. this advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. these devices are well suited for low voltage applications such as automotive, high efficiency switching for dc/dc converters, and dc motor control. features 12.9a, 80v, r ds(on) = 0.1 ? @v gs = 10 v low gate charge ( typical 8.8 nc) low crss ( typical 29 pf) fast switching 100% avalanche tested improved dv/dt capability low level gate drive requirements allowing direct operation from logic drives absolute maximum ratings t c = 25c unless otherwise noted thermal characteristics symbol parameter fqd17n08l / fqu17n08l units v dss drain-source voltage 80 v i d drain current - continuous (t c = 25c) 12.9 a - continuous (t c = 100c) 8.2 a i dm drain current - pulsed (note 1) 51.6 a v gss gate-source voltage 20 v e as single pulsed avalanche energy (note 2) 100 mj i ar avalanche current (note 1) 12.9 a e ar repetitive avalanche energy (note 1) 4.0 mj dv/dt peak diode recovery dv/dt (note 3) 6.5 v/ns p d power dissipation (t a = 25c) * 2.5 w power dissipation (t c = 25c) 40 w - derate above 25c 0.32 w/c t j , t stg operating and storage temperature range -55 to +150 c t l maximum lead temperature for soldering purposes, 1/8 ? from case for 5 seconds 300 c symbol parameter typ max units r jc thermal resistance, junction-to-case -- 3.13 c / w r ja thermal resistance, junction-to-ambient * -- 50 c / w r ja thermal resistance, junction-to-ambient -- 110 c / w * when mounted on the minimum pad size recommended (pcb mount) ! " ! ! ! " " " ! " ! ! ! " " " s d g to-252 to-251 ks,md17n08l / ksmu17n08l 2014-7-15 1 www.kersemi.com
(note 4) (note 4, 5) (note 4, 5) (note 4) electrical characteristics t c = 25c unless otherwise noted notes: 1. repetitive rating : pulse width limited by maximum junction temperature 2. l = 0.83mh, i as = 12.9a, v dd = 25v, r g = 25 ?, starting t j = 25c 3. i sd 16.5a, di/dt 300a/ s, v dd bv dss, starting t j = 25c 4. pulse test : pulse width 300 s, duty cycle 2% 5. essentially independent of operating temperature symbol parameter test conditions min typ max units off characteristics bv dss drain-source breakdown voltage v gs = 0 v, i d = 250 a 80 -- -- v ? bv dss / ? t j breakdown voltage temperature coefficient i d = 250 a, referenced to 25c -- 0.08 -- v/c i dss zero gate voltage drain current v ds = 80 v, v gs = 0 v -- -- 1 a v ds = 64 v, t c = 125c -- -- 10 a i gssf gate-body leakage current, forward v gs = 20 v, v ds = 0 v -- -- 100 na i gssr gate-body leakage current, reverse v gs = -20 v, v ds = 0 v -- -- -100 na on characteristics v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 1.0 -- 2.0 v r ds(on) static drain-source on-resistance v gs = 10 v, i d = 6.45 a v gs = 5 v, i d = 6.45 a -- 0.076 0.090 0.100 0.115 ? g fs forward transconductance v ds = 25 v, i d = 6.45 a -- 11.7 -- s dynamic characteristics c iss input capacitance v ds = 25 v, v gs = 0 v, f = 1.0 mhz -- 400 520 pf c oss output capacitance -- 120 155 pf c rss reverse transfer capacitance -- 29 37 pf switching characteristics t d(on) turn-on delay time v dd = 40 v, i d = 16.5 a, r g = 25 ? -- 7 25 ns t r turn-on rise time -- 290 590 ns t d(off) turn-off delay time -- 20 50 ns t f turn-off fall time -- 75 160 ns q g total gate charge v ds = 64 v, i d = 16.5 a, v gs = 5 v -- 8.8 11.5 nc q gs gate-source charge -- 2.0 -- nc q gd gate-drain charge -- 5.4 -- nc drain-source diode characteristics and maximum ratings i s maximum continuous drain-source diode forward current -- -- 12.9 a i sm maximum pulsed drain-source diode forward current -- -- 51.6 a v sd drain-source diode forward voltage v gs = 0 v, i s = 12.9 a -- -- 1.5 v t rr reverse recovery time v gs = 0 v, i s = 16.5 a, di f / dt = 100 a/ s -- 55 -- ns q rr reverse recovery charge -- 85 -- nc ks,md17n08l / ksmu17n08l 2014-7-15 2 www.kersemi.com
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 10 -1 10 0 10 1 25 150 notes : 1. v gs = 0v 2. 250 s pulse test i dr , reverse drain current [a] v sd , source-drain voltage [v] 0246810 10 -1 10 0 10 1 notes : 1. v ds = 25v 2. 250 s pulse test -55 150 25 i d , drain current [a] v gs , gate-source voltage [v] 10 -1 10 0 10 1 10 0 10 1 v gs top : 10.0 v 8.0 v 6.0 v 5.0 v 4.5 v 4.0 v 3.5 v bottom : 3.0 v notes : 1. 250 s pulse test 2. t c = 25 i d , drain current [a] v ds , drain-source voltage [v] 0 2 4 6 8 10121416 0 2 4 6 8 10 12 v ds = 40v v ds = 64v note : i d = 16.5a v gs , gate-source voltage [v] q g , total gate charge [nc] 10 -1 10 0 10 1 0 100 200 300 400 500 600 700 800 900 1000 1100 c iss = c gs + c gd (c ds = shorted) c oss = c ds + c gd c rss = c gd notes : 1. v gs = 0 v 2. f = 1 mhz c rss c oss c iss capacitance [pf] v ds , drain-source voltage [v] 0 1020304050 0.0 0.1 0.2 0.3 0.4 note : t j = 25 v gs = 10v v gs = 5v r ds(on) [ ? ], drain-source on-resistance i d , drain current [a] typical characteristics figure 5. capacitance characteristics figure 6. gate charge characteristics figure 3. on-resistance variation vs. drain current and gate voltage figure 4. body diode forward voltage variation vs. source current and temperature figure 2. transfer characteristics figure 1. on-region characteristics ks,md17n08l / ksmu17n08l 2014-7-15 3 www.kersemi.com
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 -1 10 0 n ote s : 1. z jc (t) = 3.13 /w m ax. 2. d u ty f actor, d =t 1 /t 2 3. t jm - t c = p dm * z jc (t) single pulse d=0.5 0.02 0.2 0.05 0.1 0.01 z jc (t), therm al response t 1 , s q u are w ave p u lse d ura tion [sec] 25 50 75 100 125 150 0 3 6 9 12 15 i d , drain current [a] t c , case temperature [ ] 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 dc 10 ms 1 ms 100 s operation in this area is limited by r ds(on) notes : 1. t c = 25 o c 2. t j = 150 o c 3. single pulse i d , drain current [a] v ds , drain-source voltage [v] -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 notes : 1. v gs = 10 v 2. i d = 6.45 a r ds(on) , (normalized) drain-source on-resistance t j , junction temperature [ o c] -100 -50 0 50 100 150 200 0.8 0.9 1.0 1.1 1.2 notes : 1. v gs = 0 v 2. i d = 250 a bv dss , (normalized) drain-source breakdown voltage t j , junction temperature [ o c] typical characteristics (continued) figure 9. maximum safe operating area figure 10. maximum drain current vs. case temperature figure 7. breakdown voltage variation vs. temperature figure 8. on-resistance variation vs. temperature figure 11. transient thermal response curve t 1 p dm t 2 ks,md17n08l / ksmu17n08l 2014-7-15 4 www.kersemi.com
charge v gs 5v q g q gs q gd 3ma v gs dut v ds 300nf 50k 200nf 12v same type as dut charge v gs 5v q g q gs q gd 3ma v gs dut v ds 300nf 50k 200nf 12v same type as dut v gs v ds 10% 90% t d(on) t r t on t off t d(off) t f v dd 5v v ds r l dut r g v gs v gs v ds 10% 90% t d(on) t r t on t off t d(off) t f v dd 5v v ds r l dut r g v gs e as =li as 2 ---- 2 1 -------------------- bv dss -v dd bv dss v dd v ds bv dss t p v dd i as v ds (t) i d (t) time 10v dut r g l i d t p e as =li as 2 ---- 2 1 e as =li as 2 ---- 2 1 ---- 2 1 -------------------- bv dss -v dd bv dss v dd v ds bv dss t p v dd i as v ds (t) i d (t) time 10v dut r g l l i d i d t p gate charge test circuit & waveform resistive switching test circuit & waveforms unclamped inductive switching test circuit & waveforms ks,md17n08l / ksmu17n08l 2014-7-15 5 www.kersemi.com
peak diode recovery dv/dt test circuit & waveforms dut v ds + _ driver r g same type as dut v gs dv/dt controlled by r g i sd controlled by pulse period v dd l i sd 10v v gs ( driver ) i sd ( dut ) v ds ( dut ) v dd body diode forward voltage drop v sd i fm , body diode forward current body diode reverse current i rm body diode recovery dv/dt di/dt d = gate pulse width gate pulse period -------------------------- dut v ds + _ driver r g same type as dut v gs dv/dt controlled by r g i sd controlled by pulse period v dd l l i sd 10v v gs ( driver ) i sd ( dut ) v ds ( dut ) v dd body diode forward voltage drop v sd i fm , body diode forward current body diode reverse current i rm body diode recovery dv/dt di/dt d = gate pulse width gate pulse period -------------------------- d = gate pulse width gate pulse period -------------------------- ks,md17n08l / ksmu17n08l 2014-7-15 6 www.kersemi.com
package dimensions 6.60 dpak ks,md17n08l / ksmu17n08l 2014-7-15 7 www.kersemi.com
package dimensions (continued) 6.60 ipak ks,md17n08l / ksmu17n08l 2014-7-15 8 www.kersemi.com
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